wafer bumping meaning in Chinese
晶圆凸块
Examples
- Wafer bumping technology for wlp
圆片级封装的凸点制作技术 - For a wafer bumping stencil , the cutting technology must be capable of producing thousands of small , closely spaced apertures to extremely tight dimensional and positional tolerances
对于晶片凸起钢网，切割技术应能够生产尺寸和位置要求极其严的好几千小而密的孔。